- 877.405.4775
- [email protected]
- 75 Robin Hill Road, Santa Barbara, CA 93117
OUR NEW MEMS SWITCH
We’ve perfected a MEMS ohmic contact relay, which is highly configurable for RF and high-power DC applications (up to 40A and above). We’ve succeeded where many companies have failed by creating an extremely small switching technology platform that is manufacturable, scalable, and capable of the highest current density of any switch in the world — over one amp through our switches unit cell (a component only 1mm x 1mm in size).
Smaller relays translate into more switching capacity in a smaller space with less weight. Regardless of market or industry, a smaller size generally leads to greater product innovation, lower overall costs, and competitive advantage. MEMS can be installed in locations impossible for full-size components. Without MEMS, smartphones and electronic wearables would not enjoy essential features, and certain modern products would simply not exist.
Traditional relays have been large and heavy. Cenfire’s MEMS platform is hundreds of times smaller and still easily customizable.
>10x Smaller
Only 0.1cm³
Cenfire’s MEMS platform will respond in under ten microseconds – hundreds of times faster than conventional components – and will do so reliably time after time after time.
>10x Faster
10us
In a conventional MEMS switch, the cantilever beam flexes at one point, just past its anchor. Repeated cycling of the switch causes the metal to fatigue, leading to the potential failure of the switch, typically in the closed position.
With Cenfire, the fatigue problem is solved through the core design.
Though specified to withstand one billion cycles, Cenfire’s platform has been successfully tested to as many as 6.5 billion cycles.
60x Longer Life
1B Switching Cycles
Cenfire’s platform can carry over one amp of current across a 1 mm x 1 mm component – ten times the capacity of competing technologies and coming close to the current density of a plain copper wire.
This is possible due to Cenfire’s use of silicon in both the substrate and the armature’s supporting structure.
>10x More Current
1A/mm²
