Engineered FOR YOUR NEXT-GEN APPLICATIONS
Each die forms a switch channel. For a total of 4 switch channels per assembly.
Breakthrough design delivers a consistently reliable galvanically isolated electrostatic switch.
Application Specific Integrated Circuit (ASIC) provides the MEMS die driver signal and has a digital interface
4x6x2 mm footprint
what makes us different
Request a quote and our engineering team will review your application to provide the right-sized solution for your needs.